(BRIEF) Infineon Technologies AG launches the SSO10T TSC package, which integrates the OptiMOS™ MOSFET generation with a smarter direct cooling concept, ensuring excellent thermal functionality in automotive electronic units. This state-of-the-art package facilitates a compact double-sided PCB design, especially reducing cooling needs and formula prices for various automotive programs, such as electric power steering, force distribution, and DCDC converters. With up to 50% greater functionality than the popular SSO8, the SSO10T TSC is poised to become the industry popular for the most sensitive cooling. , promising a more efficient and sustainable vehicle future.
(PRESS RELEASE) MUNICH, March 27, 2024 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the SSO10T TSC package with OptiMOS™ MOSFET technology. Thanks to its more sensitive direct cooling concept, the package offers perfect thermal performance. This eliminates heat flow to or through the PCB of the automotive electronics unit. The package allows for an undisputed and compact double-sided PCB design and minimizes cooling needs and formula costs for long-term automotive power designs. makes the SSO10T TSC ideal for programs such as electric power steering (EPS), EMB, power distribution, brushless DC drives (BLDCs), safety switches, inverted battery, and DCDC converters.
The SSO10T TSC is five x 7 mm² in size and is based on the industry’s popular SSO8, a rugged five x 6 mm² housing. However, thanks to its more sensitively mounted cooling, the SSO10 TSC offers 20% and up to five 0% higher functionality than the popular SSO8, depending on the thermal interface material (TIM) used and the thickness of the TIM. The SSO10T TSC package is indexed by JEDEC for the open market and offers extensive second-source compatibility. As a result, the housing can be incorporated temporarily and seamlessly as a long-term option for more responsive cooling.
The SSO10T package allows for a very compact PCB design and reduces the space taken up by the formula. It also reduces the burden of the refrigeration design by eliminating vias, resulting in relief in overall formula pricing and design efforts. At the same time, the casing offers maximum strength density and efficiency, supporting the progression of sustainable and scalable vehicles.
Availability
The first 40V automotive MOSFET products with SSO10T are now available: IAUCN04S6N007T, IAUCN04S6N009T, IAUCN04S6N013T, IAUCN04S6N017T. You can learn more at https://www. infineon. com/cms/en/product/promopages/SSO10T/
Infineon to the integrated world
Embedded World will take place from April 9 to 11, 2024 in Nuremberg, Germany. Infineon will be showcasing its products and responses for decarbonization and digitalization in Hall 4A, booth No. 138 and virtually. The company’s representatives will also conduct several TechTalks as presentations at the Embedded World convention that accompanies this convention, followed by discussions with the speakers. If you would like to interview an expert at the show, please email media. relations@infineon. com. Industry analysts interested in a briefing can email MarketResearch. Relations@infineon. com. Information on Embedded World highlights can be found in www. infineon. com/embeddedworld.
About Infineon
Infineon Technologies AG is a global leader in semiconductors in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has approximately 58,600 workers abroad and generated profits of approximately €16. 3 billion in fiscal year 2023 (ended September 30). Infineon is indexed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the United States on the OTCQX foreign over-the-counter market (ticker symbol: IFNNY).
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SOURCE: Infineon Technologies AG
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